Ceramic bond diamond grinding wheel
Appliable material: Semiconductor wafers and solar wafers, PCD (drill bits),CVD,PCBN,tungsten carbide,engineering structural ceramics,gem,crystal,magnetic material and other hard and brittle material.
Resin bond diamond grinding wheel
Appliable material :Non metallic materials,tungsten carbide, ceramic, agate, optical glass, semiconductor materials,cast iron,stone and so on.
Metal bond diamond grinding wheel
Appliable material:Glass,ceramic,silicon wafer,floor slab,marble,granite,concrete,semiconductor materials and super hard materials.
Good for non metallic materials.
High efficiency and low consumption.
Good thermal conductivity.
Less heat in grinding, fewer burned workpiece.
Predictable quality and shape for the workpiece.
Add：No. 866, Weilai Road, Guancheng Zone, Zhengzhou, 450009,Henan,China